There have been many rumors and rumors about the next generation of popular AirPad headphones, and it is said that Apple intends to update the standard version this year and the Pro version of the headphones with a new design next year. However, the exact date for the unveiling of these headphones has not been determined yet, and most of the reports provide contradictory information. Earlier, there were rumors that Apple would unveil the new model of the standard AirPad at this year’s WWDC event, while others considered it unveiled at an event related to Apple Music’s Lossless feature.

Now, a new report from Nikkei Asia claims that the tech giant is planning to start mass production of the AirPad 3 from August (August to September) this year, which has been redesigned in line with the mass production of other products such as the iPhone 13 and MacBook Pro.

Evidence shows that the third generation AirPod, similar to the current AirPod Pro, has shorter stems and replaceable silicone pads; But to reduce the price, it will not have advanced features such as active noise cancellation.

In addition, suppliers are said to be developing a system-in-package (SiP) for use in the next AirPad, and apparently the same SiP, like the Pro model, uses the H1 chip for audio enhancements. According to previous reports, Apple suppliers such as Zhen Ding, Nan Ya Zhen Ding, Unimicron, Kinsus, LG Innotek, Semco and AT&S have begun production of BT platform shipments for the next generation of Apple products, including the AirPad, Apple Watch and iPhone, and possibly NOR flash memory. Apple Wireless Headphones are exclusively supplied by Winbond.