According to Apple Insider , citing sources close to Apple’s product supply chain, production of flexible circuit boards and SIP (system-in-package) chips for the AirPad 3 has begun, and apparently they will be delivered to Apple assembling companies in the third to fourth quarters of this year. AD is increasing. Digitimes quotes its sources as saying that the next AirPad could be unveiled in the second half of 2021 along with the iPhone 13 series. The magazine believes that the third generation of Apple’s fully wireless headphones will be reasonably priced and will experience significant sales due to the removal of wired headphones from the iPhone case.

The Digitimes report follows another report on the unveiling of the next AirPad in August, and indicates that the tech giant will soon unveil its next wireless headphones. The third-generation AirPod is the first update to these headphones since March 2019, which offered wireless charging support and the Hey Siri command. Compared to this small upgrade, the next version of the AirPod is expected to feature a completely new design borrowed from the AirPad Pro.

So far, pictures of Apple’s next headphone case and chassis have been released, which show a design that fits the rumors. The pictures above show the AirPad 3 with a shorter stem and equipped with silicone pads; In other words, these headphones look exactly like the AirPad Pro; The difference is that it will probably use weaker hardware to lower prices.

The second-generation AirPad, based on wired charging, is currently priced at $ 159; While the version with the wireless charging case is priced at $ 199, and finally, there is the Pro version which is available for $ 249. It is believed that the AirPad 3 could be priced between the three products, and this is likely to lead to a decent sale. In the case of the AirPad Pro, it is said that this product will support fitness tracking and may have a compact design similar to the Bates Studio Bads headphones .