Digitimes: Apple’s suppliers have begun production of the third generation AirPad SiP

 According to recent reports, Apple is developing another member of its series of wireless headphones called the AirPad 3. Evidence shows that the third generation  AirPod , similar to the current AirPod Pro, has a shorter stem and replaceable silicone pads; But to reduce the price, it will not have advanced features such as active noise cancellation. Suppliers are reportedly developing a system-in-package ( SiP) for use in the next AirPad, and apparently the same SiP, like the Pro model, uses the H1 chip for audio enhancements. MacRumorsCiting Digitimes sources, it has compiled a report showing that Apple suppliers such as Zhen Ding, Nan Ya Zhen Ding, Unimicron, Kinsus, LG Innotek, Semco, AT&S are producing BT platform shipments for the next generation of Apple products, including the AirPad, Apple Watch and IPhone has started; Products that all use the SiP (Package System) module